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1

Sorption of water and organic solutes in polyimide films and its effects on dielectric properties

B. S. Lim, A. S. Nowick, Kang-Wook Lee, Alfred Viehbeck

Journal:

Journal of Polymer Science Part B: Polymer Physics

Year:

1993

Language:

english

File:

PDF, 901 KB

english, 1993

2

Direct parameter extraction of SiGe HBTs for the VBIC bipolar compact model

Kyungho Lee, Kwangsik Choi, Sang-Ho Kook, Dae-Hyung Cho, Kang-Wook Park, Bumman Kim

Journal:

IEEE Transactions on Electron Devices

Year:

2005

Language:

english

File:

PDF, 923 KB

english, 2005

3

Improved VBIC model for SiGe HBTs with an unified model of heterojunction barrier effects

Kyungho Lee, Dae-Hyung Cho, Kang-Wook Park, Bumman Kim

Journal:

IEEE Transactions on Electron Devices

Year:

2006

Language:

english

File:

PDF, 1.03 MB

english, 2006

4

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Impact of deep-via plasma etching process on transistor performance in 3D-IC with via-last backside TSV

Sugawara, Yohei, Hashiguchi, Hideto, Tanikawa, Seiya, Kino, Hisashi, Lee, Kang-Wook, Fukusima, Takafumi, Koyanagi, Mitsumasa, Tanaka, Tetsu

Year:

2015

Language:

english

File:

PDF, 1.12 MB

english, 2015

5

Quantitative Analysis for Country Classification in the Construction Industry

Lee, Kang-Wook, Han, Seung H.

Journal:

Journal of Management in Engineering

Year:

2017

Language:

english

File:

PDF, 1.86 MB

english, 2017

6

Novel interconnection technology for heterogeneous integration of MEMS–LSI multi-chip module

Kang-Wook Lee, Mitsumasa Koyanagi

Journal:

Microsystem Technologies

Year:

2010

Language:

english

File:

PDF, 786 KB

english, 2010

7

Country Portfolio Solutions for Global Market Uncertainties

Jung, Wooyong, Han, Seung H., Lee, Kang-Wook

Journal:

Journal of Management in Engineering

Year:

2012

Language:

english

File:

PDF, 813 KB

english, 2012

8

[IEEE 2001 IEEE International Solid-State Circuits Conference. Digest of Technical Papers - San Francisco, CA, USA (5-7 Feb. 2001)] 2001 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC (Cat. No.01CH37177) - Neuromorphic vision chip fabricated using three-dimensional integration technology

Koyanagi, M., Nakagawa, Y., Kang-Wook Lee,, Nakamura, T., Yamada, Y., Inamura, K., Ki-Tae Park,, Kurino, H.

Year:

2001

Language:

english

File:

PDF, 371 KB

english, 2001

9

Impacts of Cu Contamination on Device Reliabilities in 3-D IC Integration

Kang-Wook Lee,, Ji-Chel Bea,, Ohara, Yuki, Murugesan, Mariappan, Fukushima, Takafumi, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 2.26 MB

english, 2014

10

Modification of polyimide surface morphology: relationship between modification depth and adhesion strength

Journal:

Journal of Adhesion Science and Technology

Year:

1994

Language:

english

File:

PDF, 2.15 MB

english, 1994

11

Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies for Microelectronic System Integration

Ito, Yuka, Fukushima, Takafumi, Kino, Hisashi, Lee, Kang-Wook, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

Journal of Microelectromechanical Systems

Year:

2016

Language:

english

File:

PDF, 2.10 MB

english, 2016

12

Nondestructive Characterization of Molecular Structures at Buried Copper/Epoxy Interfaces and Their Relationship to Locus of Failure Analysis

Myers, John N., Zhang, Xiaoxian, Xiu, Yonghao, Wei, Yuying, Williamson, Jaimal M., Lee, Kang-Wook, Chen, Zhan

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 2.12 MB

english, 2015

13

Heterogeneous 3-D Integration Using Self-Assembly and Electrostatic Bonding

Koyanagi, Mitsumasa, Fukushima, Takafumi, Lee, Kang-Wook, Tanaka, Tetsu

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 3.43 MB

english, 2016

14

Accurate Indoor Location Tracking Exploiting Ultrasonic Reflections

Kim, Kang-Wook, Kwon, Jihye, Lee, Chang-Gun, Han, Junghee

Journal:

IEEE Sensors Journal

Year:

2016

Language:

english

File:

PDF, 2.40 MB

english, 2016

15

[IEEE 2017 IEEE International Interconnect Technology Conference (IITC) - HsinChu, Taiwan (2017.5.16-2017.5.18)] 2017 IEEE International Interconnect Technology Conference (IITC) - Feasibility study of Cu paste printing technique to fill deep via holes for low cost 3D TSV applications

Hai, Hoang Tri, Lee, Kang-Wook, Ando, Daisuke, Sutou, Yuji, Koyanagi, Mitsumasa, Koike, Junichi

Year:

2017

Language:

english

File:

PDF, 850 KB

english, 2017

16

System-wide Time vs. Density Tradeoff in Real-Time Multicore Fluid Scheduling

Kim, Kang-Wook, Cho, Youngeun, Eo, Jeongyoon, Lee, Chang-Gun, Han, Junghee

Journal:

IEEE Transactions on Computers

Year:

2018

Language:

english

File:

PDF, 4.17 MB

english, 2018

17

[IMPERIAL COLLEGE PRESS Proceedings of the Final Symposium of the Tohoku University 21st Century Center of Excellence Program - Sendai International Center, Japan (7 – 9 January 2007)] Future Medical Engineering Based on Bionanotechnology - BIOLOGICALLY INSPIRED VISION CHIP FABRICATED USING 3-DIMENSIONAL INTEGRATION TECHNOLOGY

KURINO, HIROYUKI, NAKAGAWA, YOSHIHIRO, NAKAMURA, TOMONORI, YAMADA, YUSUKE, LEE, KANG-WOOK, TANAKA, TETSU, KOYANAGI, MITSUMASA

Language:

english

File:

PDF, 693 KB

english

18

[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - New concept of TSV formation methodology using Directed Self-Assembly (DSA)

Fukushima, Takafumi, Murugesan, Mariappan, Ohsaki, Shin, Hashimoto, Hiroyuki, Bea, Jichoel, Lee, Kang-Wook, Tanaka, Tetsu, Koyanagi, Mitsumasa

Year:

2016

Language:

english

File:

PDF, 2.22 MB

english, 2016

19

Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration

Fukushima, Takafumi, Konno, Takayuki, Iwata, Eiji, Kobayashi, Risato, Kojima, Toshiya, Murugesan, Mariappan, Bea, Ji-Chel, Lee, Kang-Wook, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

Year:

2011

Language:

english

File:

PDF, 1.40 MB

english, 2011

20

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration

Fukushima, Takafumi, Hashiguchi, Hideto, Yonekura, Hiroshi, Kino, Hisashi, Murugesan, Mariappan, Bea, Ji-Chel, Lee, Kang-Wook, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

Year:

2016

Language:

english

File:

PDF, 4.07 MB

english, 2016

21

Analyzing Drivers of Conflict in Energy Infrastructure Projects: Empirical Case Study of Natural Gas Pipeline Sectors

Park, Chan, Han, Seung, Lee, Kang-Wook, Lee, Yong

Journal:

Year:

2017

Language:

english

File:

PDF, 1.08 MB

english, 2017

22

Renin-angiotensin blockade lowers MCP-1 expression in diabetic rats

Kato, Shinichiro, Luyckx, Valerie A., Ots, Mai, Lee, Kang-Wook, Ziai, Farzad, Troy, Julia L., Brenner, Barry M., Mackenzie, Harald S.

Journal:

Kidney International

Year:

1999

Language:

english

File:

PDF, 809 KB

english, 1999

23

Structure-property relationships of hydrido organo siloxane polymer (HOSP)

Ann R. Fornof, Christy Tyberg, Jeffrey Hedrick, Kang-Wook Lee, Stephen Cohen

Journal:

Polymer Bulletin

Year:

2002

Language:

english

File:

PDF, 103 KB

english, 2002

24

Growth of ODPA-APB polyimide films using molecular beam deposition, and their characterization

Christos D. Dimitrakopoulos, Steven P. Kowalczyk, Kang-Wook Lee

Journal:

Year:

1995

Language:

english

File:

PDF, 1023 KB

english, 1995

25

Proinflammatory gene expression and macrophage recruitment in the rat remnant kidney

Taal, Maarten W., Zandi-Nejad, Kambiz, Weening, Berber, Shahsafaei, Aliakbar, Kato, Shinichiro, Lee, Kang-Wook, Ziai, Farzad, Jiang, Tang, Brenner, Barry M., Mackenzie, Harald S.

Journal:

Kidney International

Year:

2000

Language:

english

File:

PDF, 909 KB

english, 2000

26

Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems

Kang-Wook Lee, Noriki, A., Kiyoyama, K., Fukushima, T., Tanaka, T., Koyanagi, M.

Journal:

IEEE Transactions on Electron Devices

Year:

2011

Language:

english

File:

PDF, 1.84 MB

english, 2011

27

Design of a composite right/left-handed transmission line unit-cell for a U-shaped mushroom ZOR antenna based on left-handed metamaterials

Cherl-Hee Lee, Jonghun Lee, Dong-Sik Woo, Kang-Wook Kim

Journal:

Journal of the Korean Physical Society

Year:

2012

Language:

english

File:

PDF, 170 KB

english, 2012

28

[IEEE 2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) (Formerly known as SOI Conference) - Monterey, CA, USA (2013.10.7-2013.10.10)] 2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - 3D hetero-integration technology with backside TSV and reliability challenges

Lee, Kang-Wook, Murugesan, M., Fukushima, T., Tanaka, T., Koyanagi, M.

Year:

2013

Language:

english

File:

PDF, 303 KB

english, 2013

29

Control and Modification of Nematic Liquid Crystal Pretilt Angles on Polyimides

Lee, Kang-Wook, Lien, Alan, Stathis, James H., Paek, Sang-Hyon

Journal:

Japanese Journal of Applied Physics

Year:

1997

File:

PDF, 1.15 MB

1997

30

Hygrothermal Aging Effects on Buried Molecular Structures at Epoxy Interfaces

Myers, John N., Zhang, Chi, Lee, Kang-Wook, Williamson, Jaimal, Chen, Zhan

Journal:

Year:

2014

Language:

english

File:

PDF, 1.46 MB

english, 2014

31

[IEEE 2009 IEEE International Electron Devices Meeting (IEDM) - Baltimore, MD, USA (2009.12.7-2009.12.9)] 2009 IEEE International Electron Devices Meeting (IEDM) - Three-dimensional integration technology based on reconfigured wafer-to-wafer and multichip-to-wafer stacking using self-assembly method

Fukushima, Takafumi, Iwata, Eiji, Ohara, Yuki, Noriki, Akihiro, Inamura, Kiyoshi, Lee, Kang-Wook, Jicheol Bea,, Tanaka, Tetsu, Koyanagi, Mitsumasa

Year:

2009

Language:

english

File:

PDF, 1.61 MB

english, 2009

32

Barrier Properties of CVD Mn Oxide Layer to Cu Diffusion for 3-D TSV

Lee, Kang-Wook, Wang, Hao, Bea, Ji-Cheol, Murugesan, Mariappan, Sutou, Yuji, Fukushima, Takafumi, Tanaka, Tetsu, Koike, Junichi, Koyanagi, Mitsumasa

Journal:

IEEE Electron Device Letters

Year:

2014

Language:

english

File:

PDF, 422 KB

english, 2014

33

[IEEE 51st Electronic Components and Technology Conference 2001. Proceedings - Orlando, FL, USA (29 May-1 June 2001)] 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Evaluation of Cu capping alternatives for polyimide-Cu MCM-D

Perfecto, E., Kang-Wook Lee,, Hamel, H., Wassick, T., Cline, C., Oonk, M., Feger, C., McHerron, D.

Year:

2001

Language:

english

File:

PDF, 581 KB

english, 2001

34

[IEEE 2012 IEEE 9th Int'l Conference on Ubiquitous Intelligence & Computing / 9th Int'l Conference on Autonomic & Trusted Computing (UIC/ATC) - Fukuoka, Japan (2012.09.4-2012.09.7)] 2012 9th International Conference on Ubiquitous Intelligence and Computing and 9th International Conference on Autonomic and Trusted Computing - Exploiting Ultrasonic Reflections for Improving Accuracy of Indoor Location Tracking

Kim, Kang-Wook, Park, Myung-Gon, Hishikawa, Takao, Han, Junghee, Lee, Chang-Gun

Year:

2012

Language:

english

File:

PDF, 307 KB

english, 2012

35

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - No Clean Flux technology for large die flip chip packages

Horibe, Akihiro, Lee, Kang-Wook, Okamoto, Keishi, Mori, Hiroyuki, Orii, Yasumitsu, Nishizako, Yuki, Suzuki, Osamu, Shirai, Yukio

Year:

2013

Language:

english

File:

PDF, 1.31 MB

english, 2013

36

Impacts of 3-D Integration Processes on Memory Retention Characteristics in Thinned DRAM Chip for High-Reliable 3-D DRAM

Lee, Kang-Wook, Tanikawa, Seiya, Murugesan, Mariappan, Naganuma, Hideki, Bea, Ji-Choel, Fukushima, Takafumi, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

IEEE Transactions on Electron Devices

Year:

2014

Language:

english

File:

PDF, 2.30 MB

english, 2014

37

[IEEE 2011 IEEE 25th International Conference on Advanced Information Networking and Applications (AINA) - Biopolis, Singapore (2011.03.22-2011.03.25)] 2011 IEEE International Conference on Advanced Information Networking and Applications - Holistic Optimization of Real-Time IEEE 802.15.4/ZigBee Networks

Park, Myung-Gon, Kim, Kang-Wook, Lee, Chang-Gun

Year:

2011

Language:

english

File:

PDF, 249 KB

english, 2011

38

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Flux-assisted self-assembly with microbump bonding for 3D heterogeneous integration

Ito, Yuka, Fukushima, Takafumi, Lee, Kang-Wook, Choki, Koji, Tanaka, Tetsu, Koyanagi, Mitsumasa

Year:

2013

Language:

english

File:

PDF, 2.20 MB

english, 2013

39

Die-Level 3-D Integration Technology for Rapid Prototyping of High-Performance Multifunctionality Hetero-Integrated Systems

Lee, Kang-Wook, Ohara, Yuki, Kiyoyama, Kouji, Bea, Ji-Cheol, Murugesan, Mariappan, Fukushima, Takafumi, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

IEEE Transactions on Electron Devices

Year:

2013

Language:

english

File:

PDF, 3.32 MB

english, 2013

40

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Electrochemical reactions in solder mask of flip chip-plastic ball grid array package

Lee, Kang-Wook, Barbeau, Stephane, Racicot, Francois, Powell, Douglas, Arvin, Charles, Wassick, Thomas, Ross, Joseph

Year:

2013

Language:

english

File:

PDF, 1.45 MB

english, 2013

41

The Clinicopathologic Significance of Endothelial Tubuloreticular Inclusions in Glomerular Diseases

Lee, Chang-Joo, Suh, Kwang-Sun, Kim, Kyung-Hee, Chang, Yoon-Kyung, Na, Ki-Ryang, Lee, Kang-Wook

Journal:

Ultrastructural Pathology

Year:

2013

Language:

english

File:

PDF, 2.34 MB

english, 2013

42

Effect of the environment on the measured values of the adhesion of polyimide to silicon

Paek, Sang-Hyon, Lee, Kang-Wook, Durning, Christopher J.

Journal:

Journal of Adhesion Science and Technology

Year:

1999

Language:

english

File:

PDF, 1.25 MB

english, 1999

43

[IEEE 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Xian, China (2012.10.29-2012.11.1)] 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology - Heterogeneous 3D integration technology and new 3D LSIs

Koyanagi, Mitsumasa, Lee, Kang-Wook, Fukushima, Takafumi, Tanaka, Tetsu

Year:

2012

Language:

english

File:

PDF, 873 KB

english, 2012

44

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Direct multichip-to-wafer 3D integration technology using flip-chip self-assembly of NCF-covered known good dies

Ito, Yuka, Murugesan, Mariappan, Fukushima, Takafumi, Lee, Kang-Wook, Choki, Koji, Tanaka, Tetsu, Koyanagi, Mitsumasa

Year:

2014

Language:

english

File:

PDF, 2.86 MB

english, 2014

45

[IEEE Midwest Symposium on Circuits and Systems - Tulsa, OK, USA (4-7 Aug. 2002)] The 2002 45th Midwest Symposium on Circuits and Systems, 2002. MWSCAS-2002. - A 1.8-V frequency synthesizer for WCDMA in 0.18-μm CMOS process

Young-Mi Lee,, Ju-Sang Lee,, Ri-A Ju,, Kang-Wook Kim,, Sang-Dae Yu,

Year:

2002

Language:

english

File:

PDF, 268 KB

english, 2002

46

Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu–SnAg Microbumps and a Nonconductive Film

Fukushima, Takafumi, Bea, Jichoel, Kino, Hisashi, Nagai, Chisato, Murugesan, Mariappan, Hashiguchi, Hideto, Lee, Kang-Wook, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

IEEE Transactions on Electron Devices

Year:

2014

Language:

english

File:

PDF, 3.36 MB

english, 2014

47

Deteriorated Device Characteristics in 3D-LSI Caused by Distorted Silicon Lattice

Mariappan, Murugesan, Imai, Yasuhiko, Kimura, Shigeru, Fukushima, Takafumi, Bea, Ji-Choel, Kino, Hisashi, Lee, Kang-Wook, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

IEEE Transactions on Electron Devices

Year:

2014

Language:

english

File:

PDF, 1.22 MB

english, 2014

48

Control of wettability of polymers using organic surface chemistry

Bee, Timothy G., Cross, Elisa M., Dias, Anthony J., Lee, Kang-Wook, Shoichet, Molly S., McCarthy, Thomas J.

Journal:

Journal of Adhesion Science and Technology

Year:

1992

Language:

english

File:

PDF, 1.19 MB

english, 1992

49

Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration

Ito, Yuka, Fukushima, Takafumi, Kino, Hisashi, Lee, Kang-Wook, Choki, Koji, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

Japanese Journal of Applied Physics

Year:

2015

Language:

english

File:

PDF, 1.38 MB

english, 2015

50

Applications of three-dimensional LSI

Koyanagi, Mitsumasa, Fukushima, Takafumi, Lee, Kang-Wook, Tanaka, Tetsu

Journal:

Year:

2015

Language:

english

File:

PDF, 871 KB

english, 2015